3D IC and 2.5D IC Packaging Market Size to Hit USD 167.57 Bn by 2034
The global 3D IC and 2.5D IC packaging market size was valued at USD 60.47 billion in 2024 and is expected to hit around USD 167.57 billion by 2034, growing at a CAGR of 10.73%. 3D IC and 2.5D IC Packaging Market Key Takeaways Asia Pacific dominated the 3D IC and 2.5D IC packaging market … Read more